STRUCTURE FOR MOUNTING ELECTRONIC COMPONENT AND METHOD FOR MOUNTING ELECTRONIC COMPONENT

摘要

PROBLEM TO BE SOLVED: To provide a structure for mounting an electronic component and a method for mounting the same by which a sticking force between the electronic component and a substrate is made larger and a joint part is hardly peeled of so that the electronic component can withstand a thermal stress to the joint pat due to a change in severe outer environmental temperature. SOLUTION: An insulation resin 14 is filled between an electronic component 2 and a substrate 1, and a conductive connecting member 15 is comprised of solder particles having a plurality of kinds different in size and specific gravity which are mixed in the insulation resin 14. The solder particles are successively piled up between an electrode 13b and a land 3b and they are electrically connected with each other.