| 摘要 |
PROBLEM TO BE SOLVED: To improve the heat radiation property of a flexible substrate in a semiconductor integrated circuit package provided with a flexible substrate on which a flip-chip semiconductor chip is mounted. SOLUTION: This package is provided with the plural flexible substrates on which the semiconductor chip is mounted, a connection terminal group formed along one side of the plural flexible substrates, a rigid slave substrate where the connection terminal group for connecting connection terminals on the flexible substrate side is formed on one surface, and a sealing material for sealing the flexible substrates and the rigid slave substrate. The plural flexible substrates are erected on the slave substrate and fixed almost parallelly to each other. It is preferable that the flexible substrates are vertical to the slave substrate but they can be obliquely inclined. In the case of filling resin in the gap of the flexible substrates, it is preferable that the resin is the one with excellent heat conductivity. A heat radiation plate of a heat sink can be adhered to the semiconductor chip, and the heat radiation plate can be projected from sealing resin to the outside of the package. |
