| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a semiconductor device, which is capable of facilitating and low-cost high-density mounting without generating continuity faults, when connecting to a substrate, and to provide a method of manufacturing the same. SOLUTION: Salient bump electrodes 5 are bonded on respective pad electrodes 3, disposed on a semiconductor chip 2 for manufacturing the semiconductor device.</p> |
