发明名称 |
Resin board, manufacturing process for resin board, connection medium body, circuit board and manufacturing process for circuit board |
摘要 |
A compression function layer 60 is provided on at least one board surface. The compression function layer 60 adds a function of being compressed by receiving pressure in the direction of the board thickness to the resin board 10 which includes this layer. Thereby a sufficient pressure is applied to conductors 14.
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申请公布号 |
US2002037397(A1) |
申请公布日期 |
2002.03.28 |
申请号 |
US20010962245 |
申请日期 |
2001.09.26 |
申请人 |
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发明人 |
SUZUKI TAKESHI;TOMEKAWA SATORU;KAWAKITA YOSHIHIRO;NAKAGIRI YASUSHI;ECHIGO FUMIO |
分类号 |
H05K3/20;H05K3/38;H05K3/40;H05K3/46;(IPC1-7):B32B3/00 |
主分类号 |
H05K3/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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