| 摘要 |
<p>A chip mounting device comprising a first recognition means (3) for recognizing a first recognition mark (5) on the upper chip-retainable head (2) side, a second recognition means (4) for recognizing a second recognition mark (6) on the lower substrate-retainable stage (1) side, a third recognition means (18) for recognizing the recognition marks (5, 6) concurrently when the first recognition mark (5) is brought close to or into contact with the second recognition mark (6), and a temperature detection means (17) attached to the first recognition means (3) or the second recognition means (4), wherein calibration is made based on the recognition of the recognition marks when the temperature detection means (17) detects a beyond-allowance temperature change, whereby permitting a high-accuracy, efficient calibration independently of mechanical deformation and temperature change in environmental atmosphere.</p> |
