发明名称 |
HERMETICALLY SEALED COMPONENT ASSEMBLY PACKAGE |
摘要 |
A hermetically sealed package having wires (30) entering at the base (50) and being embedded vertically in its walls (10A-10D) for connecting to the leads (45,46) of a component assembly (41) within the package. The wires protrude vertically from the walls, serving as pins (31) for electrical connection of the leads inside the package. The component assembly is secured to an inner side of the package by an adhesive (51). A cover (20) is affixed to the upper edges of the walls by an ultrasonic weld so as to create a hermetic seal. |
申请公布号 |
WO0226008(A1) |
申请公布日期 |
2002.03.28 |
申请号 |
WO2001US28399 |
申请日期 |
2001.09.12 |
申请人 |
DATATRONIC DISTRIBUTION INCORPORATED |
发明人 |
SIU, PAUL |
分类号 |
H05K5/03;H01F5/00;H01L23/053;H01L23/10;H05K3/30;H05K5/00;(IPC1-7):H05K5/06 |
主分类号 |
H05K5/03 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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