METHOD OF FABRICATING CONDUCTOR STRUCTURES WITH METAL COMB BRIDGING AVOIDANCE

摘要

Various methods of inspecting a workpiece for residue are provided. In one aspect, a method of fabricating a conductor layer (60) on a substrate (40) is provided that includes forming an aluminum-copper film (64) on the substrate (40) in a first processing chamber (18) and forming an anti-reflective coating (68) on the aluminum-copper film (64) in a second processing chamber (14). The substrate (40) is moved from the second processing chamber (14) into a cooling chamber (30) to quench the substrate (40). A first time interval during which the substrate (40) is in the first processing chamber (18) and a second time interval during which the substrate (40) is present in the second processing chamber (14) are measured. The substrate (40) is annealed to restore a uniform equilibrium distribution of copper in the aluminum if the first time interval exceeds about 600 seconds or the second time interval exceeds about 300 seconds. The method substantially reduces the risk of metal comb bridging device failures following etch definition of conductor lines.