| 摘要 |
<p>A carrier-equipped ultrathin copper foil which comprises a laminate of a separation layer, a diffusion preventing layer, and an electric copper plating layer, or a diffusion preventing layer, a separation layer, and an electric copper plating layer in this order on the surface of a carrier foil, with a roughened surface of electric copper plating, a copper-clad laminated board comprising a laminate of the caririer-equipped ultrathin copper foil and a resin base, a printed wiring board with a wiring pattern formed on the ultrathin copper foil of the coopper-clad laminated board, and a multilayered wiring board formed by a laminate of a plurality of the printed wiring boards.</p> |
