| 摘要 |
<p>A tester comprises test logic and a connector for at least one device under test. The connector, which may comprise a wafer probe for dice on a wafer or a test fixture for either packaged integrated circuit devices or circuit board modules, has connections for the device under test that present an impedance selected to emulate the characteristic impedance of an end-use environment of the device under test. For example, in an embodiment in which the device under test comprises DDR memory and the end-use environment is a DDR memory module, the characteristic impedance is approximately 60 ohms. Thus, the tester of the present invention can accurately simulate operational behavior in an end-use environment of the device under test. Because this accurate simulation is available even for dice on a wafer, the needless expense associated with packaging defective dies and assembling defective dies into modules can be avoided. The test logic, which is coupled to the connector for communication with the device under test, transfers test commands and test data to the device under test. The test data and commands are utilized to perform multiple types of tests, including tests of the memory core and internal logic of the device under test. In this manner, the need for multiple types of testers is reduced or eliminated.</p> |
