| 摘要 |
<p>Electronic equipment, comprising a wiring substrate, an electronic part installed on the wiring substrate and having a radiating part on the surface thereof, and an insulating radiating plate thermally connected to the electronic part, wherein the radiating part is directly connected to the radiating plate with thermally conductive adhesive agent, and the radiating plate is a ceramic plate having at least one land for electronic part connection or a resin plate including a high thermally conductive material, whereby, because the insulating radiating plate is directly connected to the electronic part emitting heat, a conventional insulating plate need not be installed between the radiating plate and the electronic part, and the radiating effect of the electronic part of the electronic equipment can be increased.</p> |
