| 摘要 |
<p>The CMP apparatus (1) is equipped with an attitude-maintaining means (50) which maintains a polishing member (40) in a fixed attitude with respect to a wafer (W) by applying a corrective moment to the polishing member during the polishing of the wafer (W). This attitude-maintaining means (50) is constructed from a disk-form protruding member (51) which is detachably attached to the outer circumferential portion of a reference plate (41) by engaging with this outer circumferential portion, annular permanent magnets (54,55) which are installed in magnet holding frames (52,53) consisting of two concentric cyclindrical parts that protrude to the outside of a tension flange (31) and extend upward from the outer edge portion of the protruding member (51) a cyclindrical coil holding frame (57) which protrudes outward and extends downward from a moving stage (17) and whose lower end portion is positioned between the permanent magnets (54,55) and four coils (58) that are wound around this coil holding frame (57).</p> |
