| 摘要 |
<p>The present invention provides an epoxy resin composition having excellent moldability, flame retardancy and soldering resistance and low in water absorption. More specifically, it provides an epoxy resin composition for semiconductor encapsulation comprising (A) an epoxy resin in which the proportion of the carbon atoms of aromatic derivation to the whole carbon atoms in the epoxy resin is 70% or more, (B) a phenol resin in which the proportion of the carbon atoms of aromatic derivation to the whole carbon atoms in the phenol resin is 70% or more and whose phenolic hydroxy equivalent is 140 to 300, (C) a curing accelerator, and (D) an inorganic filler whose content W (wt%) in the whole epoxy resin composition satisfies 88</=W</=94, characterized in that the combustion starting temperature in thermogravimetric analysis of the cured epoxy resin composition in the air atmosphere is 280 DEG C or higher, or the retention A (wt%) of the cured product in said TG analysis satisfies W + Ä0.1 x (100 - W)Ü</=A.</p> |
