A method of forming a switch pattern on a switch substrate

摘要

A method of forming switch patterns on a substrate (10) comprising the steps of forming patterns (11,111) on the surface of the substrate (10) and then removing pattern-removal portions of said patterns (11,111) is disclosed. Removal of the pattern removal portions may be mechanical or by means of a laser beam. An alternate method of forming switch patterns in which patterns (11-3) are formed on a surface, insulating patterns (27-3) formed at portions between said patterns (13-3,17-3) that are to become switch patterns and then forming switch patterns (11-3) by removing pattern removal portions at boundaries between said patterns and said insulating patterns (27-3) is also disclosed, along with substrates (10,10-3) according to either method.