| 摘要 |
PROBLEM TO BE SOLVED: To provide a photosensitive resin composition excellent in developability with a dilute aqueous alkali solution and giving a cured coating film excellent in flexibility, heat resistance, adhesion, water resistance, resistance to the heat of soldering, resistance to electroless gold plating, PCT (pressure cracker test) resistance, etc. SOLUTION: The photosensitive resin composition contains (A) a photosensitive resin obtained by reacting an epoxy resin (a) with a compound (b) having one alcoholic hydroxyl group and one functional group selected from among carboxyl and secondary amino groups in one molecule and an unsaturated monobasic acid (c) and reacting the resulting reaction product (I) with a saturated or unsaturated polybasic acid anhydride (d), (B1) a polymer of one or more radical polymerizable unsaturated compounds or a polymer obtained by further reacting the above polymer with the saturated or unsaturated polybasic acid anhydride (d), (C) an epoxy resin, (D) a photopolymerization initiator and (E) a polymerizable unsaturated compound or a solvent. |
