| 摘要 |
PROBLEM TO BE SOLVED: To provide a mold clamping device of such a construction that the height of a die can be appropriately adjusted despite the very simple structure of the device. SOLUTION: A fixed platen 14 and a movable platen 18 on which a mold is mounted, under a structural linkage of both platens 14 and 18 by a tie rod, can be fixed at a mold clamping position with the help of a platen lock means 200. In addition, a wedge mechanism is provided which adjusts the position of the platen lock means 200 in the tie rod axial direction by a wedge action. The wedge mechanism is constituted of a fixed wedge 208 and a movable wedge 210 interposed in and joined on the slope to each other between the platen lock means 200 and the platen 18. Further, an insertion depth adjustment mechanism for the movable wedge 210 is provided which makes the thickness of the wedge changeable.
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