| 摘要 |
PROBLEM TO BE SOLVED: To solve the problem that the soldering of printed circuit boards with a dipping method creates a large amount of dross, mixture of fused solder and its oxides and the dross unstablizes the height of molten solder wave and/or sticks to the printed circuit boards causing defective boards, and it is economically undesirable to dispose the dross straight, as it contains a large amount of solder. SOLUTION: The dross together with the molten solder are collected into a cover heated at a high temperature, and the oxide and the solder in the dross are separated by stirring the doss with a screw. The wave soldering bath has a cover on one side and the screw is arranged in the cover.
|
