| 摘要 |
A wafer may be protected from being contaminated by contaminants and cooled at the same time. In a multi chamber CVD equipment, while a wafer arm 55 of a transfer robot transfers a high-temperature wafer 1 from a CVD chamber to a cooling chamber, the wafer 1 is covered with a cooling and guarding plate 60. The cooling and guarding plate 60 has an abutting ring 61 abutted along the perimeter of an upper surface of the wafer 1, a support ring 62 with the shape of a cylinder having a small height installed on the abutting ring 61, a covering plate 63 with the shape of a disc formed on the support ring 62, a plurality of radiating fins 64 and a set of handles 65 projected along both sides of the plurality of radiating fins 64, wherein the cooling and guarding plate arm 56 is inserted underneath the handles 65.
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