ENHANCED SURFACE STRUCTURES FOR PASSIVE IMMERSION COOLING OF INTEGRATED CIRCUITS

摘要

Enhanced surface structure formed in an integrated circuit enclosure aid the performance of device cooling through improved passive immersion cooling of the circuit. The enhanced structures includes a series of relatively large cavities below the surface of the enclosure which open to the surface by openings which are smaller than the cavities' largest dimension. The enhanced structure also includes relatively small protrusions (small scale structures) on the order of less than 10 µM on surface of the enclosure. These small protrusions allow the formation of bubbles at lower surface temperatures, reducing temperature overshoot at the onset of boiling. The larger cavities are designed to maximize heat transfer during steady state boiling. The small scale structures preferably have a cavity radius within said cavities which causes the boundary layer temperature profile for a given set of thermo-physical properties of the fluid and substrate to intersect with the bubble equilibrium equation at a single point so as to reduce thermal overshoot at incipient nucleation.