| 摘要 |
An embodiment of the present invention includes a disposable print head for ejecting controlled amounts of liquid (e.g., solder) at a high rate onto the surface (e.g., an integrated circuit) in close proximity to the ejecting source. The embodiment involves the use of a controlled burst of gas that is developed by rapidly heating a metallic hydride film with a laser to disassociate the hydrogen therefrom. The pressure created by the burst of a hydrogen gas is used to eject an amount of a liquid (e.g., a solder) from an appropriate conduit that is fed liquid from a reservoir. The surfaces in the print head that contact the liquid are coated to assist in priming the print head for a subsequent ejection event. |
