发明名称 |
Metallic boride and phosphide barrier layers for via linings |
摘要 |
<p>A material lining a via comprises either cobalt XY or nickel XY where X may be tungsten, tin or silicon, and Y is phosphorous or boron, in particular an embodiment disclosing cobalt tungsten phosphide is described. Multilayer linings including TaN are also envisaged. The layers are formed by an electroless plating method. The compounds when used to line a via opening act as a barrier to prevent material (eg copper) from wiring layers diffusing into the surrounding dielectric material.</p> |
申请公布号 |
GB2366912(A) |
申请公布日期 |
2002.03.20 |
申请号 |
GB20010006693 |
申请日期 |
2001.03.16 |
申请人 |
* INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
CARLOS J * SAMBUCETTI;STEVEN H * BOETTCHER;PETER S * LOCKE;JUDITH M * RUBINO;SOON-CHEON * SEO;SOON-CHEON * SEO;PETER S * LOCKE;STEVEN H * BOETTCHER;JUDITH M * RUBINO;CARLOS J * SAMBUCETTI |
分类号 |
H01L21/288;H01L21/28;H01L21/3205;H01L23/52;H01L23/522;(IPC1-7):H01L23/532 |
主分类号 |
H01L21/288 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|