| 发明名称 |
Method for uniform polish in microelectronic device |
| 摘要 |
A method for achieving a uniform planar surface by a chemical mechanical polish includes surrounding an active area or array to be polished with a border of the active material such that the border is wider than a single active area within the array and is preferably spaced from the outermost active area by the same distance as the distance between active areas within the array. |
| 申请公布号 |
US6358816(B1) |
申请公布日期 |
2002.03.19 |
| 申请号 |
US20000655149 |
申请日期 |
2000.09.05 |
| 申请人 |
MOTOROLA, INC. |
发明人 |
SINGH RANA P.;INGERSOLL PAUL A. |
| 分类号 |
H01L21/76;B24B37/04;H01L21/00;H01L21/304;H01L21/3105;H01L21/762;H01L21/8238;H01L21/8239;(IPC1-7):H01L21/76 |
主分类号 |
H01L21/76 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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