发明名称 PERIPHERAL EDGE GRINDING DEVICE FOR THIN PLATE
摘要 PROBLEM TO BE SOLVED: To grind a peripheral edge of a thin plate having recessed parts or projecting parts on its peripheral edge with high accuracy. SOLUTION: This peripheral edge grinding device for a thin plate has a wheel spindle inclining mechanism 1 capable of changing an inclination angle of a rotating spindle of a grinding wheel 3 to a rotating spindle of the thin plate 2, and further changing its inclining direction. Accordingly, the chamfering work (grinding work) can be executed on the recessed parts and the projecting parts of the peripheral edge with high accuracy similarly as an outer peripheral part of the thin plate by changing the inclining direction while keeping the inclination angle.
申请公布号 JP2002079446(A) 申请公布日期 2002.03.19
申请号 JP20000248818 申请日期 2000.08.18
申请人 TOKYO SEIMITSU CO LTD 发明人 HONDA KATSUO
分类号 B24B9/00;(IPC1-7):B24B9/00 主分类号 B24B9/00
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