| 发明名称 |
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SAME |
| 摘要 |
<p>A semiconductor device has (a) a semiconductor component; (b) a circuit substrate; (c) a base material which is placed between the semiconductor component and the circuit substrate; and (d) a conductive paste, which is filled into a hole formed in the base material, for electrically connecting between a terminal electrode of the semiconductor component and an internal connection electrode of the circuit substrate. <IMAGE></p> |
| 申请公布号 |
SG87034(A1) |
申请公布日期 |
2002.03.19 |
| 申请号 |
SG19990002838 |
申请日期 |
1999.06.02 |
| 申请人 |
MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. |
发明人 |
YOSHIHIRO BESSHO;MINEHIRO ITAGAKI |
| 分类号 |
H01L21/56;H01L21/60;H01L23/498;(IPC1-7):H01L23/498 |
主分类号 |
H01L21/56 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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