发明名称 Method of fabricating a semiconductor device
摘要 A substrate (901 in FIGS. 1A and 1B) is overlaid with a base film (902), an amorphous semiconductor film (903) and a first protective insulating film (904), and a thermal conduction layer (905) having a light transmissivity is selectively formed. Subsequently, the amorphous semiconductor film (903) is crystallized by laser annealing. The thermal conduction layer (905) functions to control the outflow rate of heat from the semiconductor film (903), and a crystalline semiconductor film centering round a region formed with the thermal conduction layer (905) is prepared by utilizing the difference of temperature distributions over the substrate (901). In the crystalline semiconductor film thus prepared, the location and size of a crystal grain have been controlled. A TFT capable of high-speed operation is realized by employing the crystalline semiconductor film as the channel forming region of the TFT.
申请公布号 US6358766(B1) 申请公布日期 2002.03.19
申请号 US20000598827 申请日期 2000.06.21
申请人 SEMICONDUCTOR ENERGY LABORATORY CO., LTD. 发明人 KASAHARA KENJI
分类号 H01L21/20;G02F1/136;G02F1/1368;H01L21/336;H01L21/77;H01L21/84;H01L27/12;H01L29/786;(IPC1-7):H01L21/00 主分类号 H01L21/20
代理机构 代理人
主权项
地址