发明名称 METHOD AND APPARATUS FOR REMOVING SCRAP OF MULTI-LAYERED SUBSTRATE
摘要 PURPOSE: A method and an apparatus for removing a scrap of a multi-layered substrate are provided to process an edge portion of a substrate to a circular shape by removing a scrap part generated from the edge portion of the substrate and performing a surface process of the substrate. CONSTITUTION: A substrate is loaded into the inside of a loader by performing a substrate loading process. A scrap part generated from an edge portion of the substrate is removed by performing a scrap removal process. An angle of the substrate is changed and fixed by performing a substrate angle fixing process. The substrate angle fixing process is performed to execute a trimming process and a cornering process on a predetermined region of the substrate from which the scrap is removed. An edge portion of the substrate is processed. The substrate is transferred to an unloader.
申请公布号 KR100330756(B1) 申请公布日期 2002.03.19
申请号 KR19990014701 申请日期 1999.04.23
申请人 HAN SONG HI-TECH CO., LTD. 发明人 SIN, MOON HUN
分类号 H05K3/46;(IPC1-7):H05K3/46 主分类号 H05K3/46
代理机构 代理人
主权项
地址