| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing a thermoelectric transducing element which enables to reduce production cost drastically. SOLUTION: This thermoelectric transducing element is provided with p-type thermoelectric semiconductor chips 1a and n-type thermoelectric semiconductor chips 1b that are installed side by side, an electrode that is placed on the heat absorbing side of the semiconductor chips, and the other electrode that is placed on the heat losing side of the semiconductor chips. The semiconductor chips are formed by inserting powder 4 of the semiconductor chips into holes 10 having the same shape as that of the cross section of a semiconductor chip that are formed in a mold for sintering 7, sealing the powder with an upper punch 6 and a lower punch 5 together with loading the mold for sintering and both-punches in a jig for sintering, placing heating elements 13 on both sides of the jig, and pressing the heating elements from both sides with press rams 14, 15, between which electric current is applied.
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