PACKAGING STRUCTURE OF SEMICONDUCTOR DEVICE AND DISPLAY OF STRUCTURE AND ITS MANUFACTURING METHOD

摘要

PROBLEM TO BE SOLVED: To solve the problem where a first substrate 1 is warped after salient electrodes 4a and 4b of a semiconductor device IC are subjected to thermocompression bonding, and display around a semiconductor package section 15 on the screen of a liquid crystal panel L becomes irregular for decreasing the quantity of the liquid crystal panel L, in the conventional packaging of the semiconductor device. SOLUTION: A stress restraining substrate F1 is provided between the display panel 1 and semiconductor device IC, continuity sections 9a and 9b for allowing the semiconductor device IC and the wiring pattern of the display panel 1 to conduct electricity are provided on the stress restraining substrate F1, and at the same time, the stress inhibition substrate F1 is pulled into the section between the packaging region of the display panel 1 and the semiconductor device IC for crimping via paste- or filmy adhesives 6A and 6B.