发明名称 CERAMIC MULTI-LAYER CIRCUIT BOARD
摘要 PROBLEM TO BE SOLVED: To provide a ceramic multi-layer circuit board capable of surely mounting a chip component without substantially changing the area of a cavity. SOLUTION: In the ceramic multi-layer circuit board 1 provided with the cavity for storing the chip component 6, a projection part 3 decreasing the opening area of the cavity is provided on at least one side of the cavity 2.
申请公布号 JP2002076188(A) 申请公布日期 2002.03.15
申请号 JP20000256289 申请日期 2000.08.25
申请人 KYOCERA CORP 发明人 FURUHASHI KAZUMASA
分类号 H05K3/46;H01L23/04;H01L23/12;H01L23/13;(IPC1-7):H01L23/13 主分类号 H05K3/46
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