| 摘要 |
PURPOSE: A low dielectric material including polyhedral oligomeric silsesquioxane is provided to realize a dielectric constant not higher than 2.5, by manufacturing mixture composition of the polyhedral oligomeric silsesquioxane and silicon oxide aerogel. CONSTITUTION: A dielectric material includes the polyhedral oligomeric silsesquioxane having an organic substitution and the silicon oxide aerogel which have a weight ratio of 9.9:0.1 to 1:9. The dielectric material further includes tetra alkoxysilan. The tetra alkoxysilan is tetra methoxysilan or tetra ethoxysilan. A sol-gel reaction between the polyhedral oligomeric silsesquioxane having the organic substitution and the silicon oxide aerogel is performed to fabricate the dielectric material.
|
