发明名称 PARTS ABSORBING DEVICE FOR MODULE HEAD IN SURFACE MOUNTING APPARATUS
摘要 PURPOSE: A parts absorbing device for a module head in a surface mounting apparatus is provided to shorten the time required to exchange nozzles by using a leaf spring when mounting/dismounting a holder to/from a socket to simplify the part absorbing device. CONSTITUTION: A first lengthwise through hole(113) and a fixing member(111) within the first through hole(113) are formed in a socket(110). The one end of the first through hole(113) is mounted to a hollow shaft through the fixed member(111) when the socket is mounted in the hollow shaft. A second through hole(121) forms an air passage when absorbing parts is formed in a nozzle(120). A coupling member(130) comprises a third lengthwise through hole(133) and a leaf spring(131), which is assembled to the through hole(113) and supports the nozzle(120) mounted in the other end of the through hole(113) to damp shock when absorbing the parts of the nozzle(120). The coupling member(130) is prevented from being detached from the nozzle(120) by a holder(140).
申请公布号 KR20020020499(A) 申请公布日期 2002.03.15
申请号 KR20000053698 申请日期 2000.09.09
申请人 MIRAE CORPORATION 发明人 LEE, SEUNG WON
分类号 B25J15/06;H05K13/02;H05K13/04;(IPC1-7):H05K13/02 主分类号 B25J15/06
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