METHOD FOR SURFACE TREATING CIRCUIT BOARD FOR INNER LAYER AND METHOD FOR MANUFACTURING MULTILAYER LAMINATE

摘要

PROBLEM TO BE SOLVED: To provide a method for surface treating a circuit board for an inner layer capable of uniformly treating in a shorter time in a method for conveying a long-sized circuit board for the inner layer wound in a rolled state while surface treating the board. SOLUTION: The method for surface treating the circuit board for the inner layer comprises the steps of roughing a circuit of a surface of the circuit board 1 for the inner layer with a treatment liquid while conveying the long-sized board for the inner layer wound in the rolled state. As the liquid, an acid aqueous solution containing a strong oxidizing agent is used. The method further comprises the steps of dipping the board 1 in the solution and conveying the board 1 while regulating a tension applied to the board 1 to 9.8 to 490 N.