| 摘要 |
PROBLEM TO BE SOLVED: To provide a heat radiating device for effectively radiation heat generated by a semiconductor device, such as a CPU 39 and a semiconductor memory 40, placed on a printed circuit board 38 of a cellular phone. SOLUTION: The radiation device consists of a bundle where a carbon fiber 46 bundled nearly in parallel is arranged; a resin-fixing section 47 is formed at one cut end; the bundle of the carbon fiber 46, where this sort of resin-fixing section 47 is formed, is brought into contact with the CPU 39 on the printed circuit board 38; and at the same, time the other cut end of the carbon fiber 46 is elastically pressure-welded to a heat sink 48, that is jointed to the inside of a rear cabinet 12.
|
