| 摘要 |
PROBLEM TO BE SOLVED: To provide a manufacturing system for an electronic part chip and its package which can improve the quality and yield of a product by making chips small in size and taking the correspondence between the final performance of chips which cannot be numbered or whose numbering is invisible after packaging, and the position of the chip on a wafer. SOLUTION: An intrinsic number 34 is attached to a jig for placing a wafer and a chip, and it is read by a device and a mapping data 38 is sent to a host computer 16 from the control information of the device. The host computer 16 uses the mapping information to relate testing data of each of chip with the position of the chip on the wafer.
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