| 摘要 |
PROBLEM TO BE SOLVED: To provide a machining method of a semiconductor wafer that can dice a semiconductor wafer without using any adhesive tapes for dicing and ring frames for retaining the adhesive tapes. SOLUTION: This manufacturing method of a semiconductor wafer should include a process that puts an adhesive sheet onto the surface of a semiconductor wafer where a pattern is formed, a process that performs thinning onto the back surface of the semiconductor wafer where the adhesive sheet has been applied, and a process that dices the semiconductor wafer where the adhesive sheet has been applied. |
