| 摘要 |
PROBLEM TO BE SOLVED: To provide a laminate for manufacturing a printed circuit board capable of reducing in weight and thickness with good heat resistance, adhesive properties, durability and dimensional accuracy and enhancing a density of wirings and decreasing in its thickness and a method for manufacturing a multilayer printed circuit board using the laminate. SOLUTION: The laminate is formed by forming epoxy resin composition layers each having a glass transition temperature after curing of 150 deg.C or higher in a semi-cured state on both side surfaces of a heat resistant film having a surface oxygen atom content measured according to an X-ray photoelectron spectroscopy(XPS) of 15% or more and a thickness of 20μm or less, having through holes each having a diameter of 100μm or less penetrating through the film and the epoxy resin layer, and embedding a conductive substance in the hole. The method for manufacturing the multilayer printed circuit board manufactures the board by using the laminate. |
