发明名称 MULTILAYER PRINTED WIRING BOARD
摘要 PROBLEM TO BE SOLVED: To provide a multilayer printed wiring board which is not required to make a dielectric body more uniform in thickness and can be easily manufactured. SOLUTION: A multilayer printed wiring board of strip structure is equipped with dielectric bodies 2 and 3 which are located above and below a signal line pattern 1 and asymmetrical to each other in thickness. The thickness ratio of the upper dielectric body 2 to lower dielectric body 3 is set at 2.4:1 or below. Even if the dielectric bodies 2 and 3 vary in thickness, making their thicknesses deviate slightly from the prescribed values, a change rate of Z0 due to this deviation can be made small.
申请公布号 JP2002076644(A) 申请公布日期 2002.03.15
申请号 JP20000256637 申请日期 2000.08.28
申请人 MATSUSHITA ELECTRIC WORKS LTD 发明人 MUKAI KAORU;MAEDA SHUJI
分类号 H05K3/46;(IPC1-7):H05K3/46 主分类号 H05K3/46
代理机构 代理人
主权项
地址