| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of mounting a semiconductor element, a semiconductor element and a semiconductor device, with which a semiconductor device can be made smaller and thinner and have higher performance and high connection reliability. SOLUTION: In this method of mounting a semiconductor element, a semiconductor element 100, obtained by laminating intermediate boards 130 electrically connected with a semiconductor chip 120, is mounted on a circuit board CB. A plurality of intermediate boards 130 are laminated by using interlayer connecting terminals 134b, and the intermediate boards 130 and the circuit boards CB are mounted, by using an external connecting terminal 134a made f a material which is softer than of that of the interlayer connecting terminals 134b. |
