Component mounting apparatus and method, component mounting system having the apparatus, and circuit board manufactured by the method

摘要

A component mounting apparatus has an ultrasonic vibration generating apparatus which supplies ultrasonic vibration making a lead-free solder with no lead which is provided between an electronic component and a circuit board melted to the electronic component. The lead-free solder is melted by the ultrasonic vibration and then connects the electronic component on the circuit board. Accordingly, the ultrasonic vibration generating apparatus can heat only the lead-free solder partially, the electronic component and the circuit board can be joined without applying thermal influence to a whole of the electronic component and circuit board.