BAKE UNIT

摘要

PURPOSE: A bake unit is provided to prevent a wafer from being laid across a guide when the wafer is settled on a hot plate, by precisely transferring the guide forwardly and backwardly while using a drive member. CONSTITUTION: The hot plate(103) heats the wafer. A plurality of guides(101) prevent the wafer from fluctuating, installed along the outer circumference of a wafer settle part(110) on the hot plate. An up/down pin(102) vertically transfers the wafer, positioned inside the wafer settle part. The drive member horizontally drives the plurality of guides. The drive member is positioned on the side surface of the hot plate.