PLASMA ENCAPSULATION FOR ELECTRONIC AND MICROELECTRONIC COMPONENTS SUCH AS OLEDS

摘要

The invention relates to a plasma encapsulation method for electronic and microelectronic components such as OLEDs. The inventive method does not consist of a standard plasma coating method, but of a particularly protective plasma coating method, e.g. the pulsed, "remote" or "after-glow" method, which does not damage sensitive components such as OLEDs.