Method for removing contaminants from a workpiece using a chemically reactive additive

摘要

A method for drying one or more workpieces. The method includes the use of a chemically reactive additive to remove contaminants from the wafer surface during processing. In particular, during processing, a wafer is rinsed in a liquid bath and subsequently exposed to a chemically reactive additive. The chemically reactive additive creates a surface tension gradient that physically and chemically alters the properties of the film of the rise liquid so that the liquid and any contaminants contained therein are removed from the wafer surface.