| 摘要 |
An improved manufacturing system for processing semiconductor wafers which includes a (1) plurality of processing stations, (2) a sealed transport tunnel located directly over the processing stations, (3) a transport to move wafers within the tunnel, (4) interconnection chambers joining the transport tunnel and the processing stations, (5) interface mechanisms in the interconnection chambers to move the wafers to and from the processing stations, and (6) a computer to control the operations of the transport, the interface mechanisms, and the processing equipment at the processing stations.
|
