发明名称 REINFORCED POLYAMIDE RESIN COMPOSITION
摘要 PROBLEM TO BE SOLVED: To provide a reinforced polyamide resin composition capable of giving a molding suppressing a dimensional change or rigidity lowering by moisture absorption, reducing warpage, etc., and having a high hat distortion temperature. SOLUTION: There is provided a reinforced polyamide resin composition prepared by compounding an alloy resin containing a polyamide resin and/or a polyamide rein and a polyolefin resin with 5-50 wt.% talc having acid solubles content of at most 1.5 wt.% as measured by a testing method of the Japanese Pharmacopoeia.
申请公布号 JP2002069297(A) 申请公布日期 2002.03.08
申请号 JP20000265852 申请日期 2000.09.01
申请人 TOYOBO CO LTD 发明人 TAMURA TSUTOMU;NAKAGAWA TOMOHIDE
分类号 C08L77/02;C08K3/34;C08L23/02;(IPC1-7):C08L77/02 主分类号 C08L77/02
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