发明名称 |
SEMICONDUCTOR WAFER PACKAGING BAG AND METHOD FOR PACKING SEMICONDUCTOR WAFER USING THE SAME |
摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor wafer packaging bag wherein even a heavy-weighted shipment container containing a wafer which is increased in diameter is easy to put in/out of an outer packaging box so that workability can be improved. SOLUTION: The semiconductor wafer packaging bag 1 for packaging a shipment container receiving a semiconductor wafer comprises a handle 4 provided thereon. The handle 4 preferably comprises a welded portion 2 of the bag and a hole 3 opened on the welded portion, wherein a plurality of circular or elliptic holes are preferably provided.
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申请公布号 |
JP2002068216(A) |
申请公布日期 |
2002.03.08 |
申请号 |
JP20000258517 |
申请日期 |
2000.08.29 |
申请人 |
SHIN ETSU HANDOTAI CO LTD;FUJIMORI PRA CHEMICAL KK |
发明人 |
TOYAMA KOHEI;SHIMIZU TASUKU |
分类号 |
B65D33/08;B65D75/12;B65D77/04;B65D81/02;B65D85/86;H01L21/673;(IPC1-7):B65D33/08 |
主分类号 |
B65D33/08 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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