发明名称 |
PLASMA GENERATING EQUIPMENT, DENSE AND HARD THIN FILM FORMING EQUIPMENT USING THE SAME, AND HARD THIN FILM FORMING METHOD |
摘要 |
PROBLEM TO BE SOLVED: To provide a film forming method and a film forming equipment, wherein reduction of absorption efficiency of RF power can be prevented while a dense and hard thin film similar to BN film and containing lots of SP3 microstructures can be produced. SOLUTION: Plasma generating chamber is located adjacent to a film forming chamber containing a substrate inside and retainable in a high vacuum. In the plasma generating chamber, a high-frequency antenna used for generating plasma and a target composed of the material essentials for the dense and hard thin film are respectively arranged. Generation of high-density plasma under the arrangements enables to introduce the atoms of target materials sputtered from the target to the substrate in ionized state. |
申请公布号 |
JP2002069635(A) |
申请公布日期 |
2002.03.08 |
申请号 |
JP20000269097 |
申请日期 |
2000.09.05 |
申请人 |
ULVAC JAPAN LTD |
发明人 |
AGAWA YOSHIAKI;NAITO TETSUO;SETSUHARA YUICHI;SAKAWA YOICHI |
分类号 |
H05H1/46;B01J19/08;C23C14/34 |
主分类号 |
H05H1/46 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|