发明名称 PLASMA GENERATING EQUIPMENT, DENSE AND HARD THIN FILM FORMING EQUIPMENT USING THE SAME, AND HARD THIN FILM FORMING METHOD
摘要 PROBLEM TO BE SOLVED: To provide a film forming method and a film forming equipment, wherein reduction of absorption efficiency of RF power can be prevented while a dense and hard thin film similar to BN film and containing lots of SP3 microstructures can be produced. SOLUTION: Plasma generating chamber is located adjacent to a film forming chamber containing a substrate inside and retainable in a high vacuum. In the plasma generating chamber, a high-frequency antenna used for generating plasma and a target composed of the material essentials for the dense and hard thin film are respectively arranged. Generation of high-density plasma under the arrangements enables to introduce the atoms of target materials sputtered from the target to the substrate in ionized state.
申请公布号 JP2002069635(A) 申请公布日期 2002.03.08
申请号 JP20000269097 申请日期 2000.09.05
申请人 ULVAC JAPAN LTD 发明人 AGAWA YOSHIAKI;NAITO TETSUO;SETSUHARA YUICHI;SAKAWA YOICHI
分类号 H05H1/46;B01J19/08;C23C14/34 主分类号 H05H1/46
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