发明名称 Method for formation of semiconductor device pattern, method for designing photo mask pattern, photo mask and process for photo mask
摘要 A shielding film is formed on the surface of a substrate and a pair of aperture patterns for light transmission with substantially the same line width are formed in the above shielding film so as to run parallel to each other with a gap and to be isolated from other aperture patterns for light transmission. The exposure amount (exposure energy to sufficiently large aperture pattern) at the time a photoresist is exposed by using this photo mask is 4 or more times and 20 or less times as large as the exposure amount on the border where the photoresist is converted from soluble to insoluble through the exposure or the exposure amount on the border from insoluble to soluble. Thereby, it becomes possible to form a microscopic pattern without using an auxiliary pattern method or a phase shift mask and the default inspection of a mask can be made easy.
申请公布号 US2002028391(A1) 申请公布日期 2002.03.07
申请号 US20010782283 申请日期 2001.02.14
申请人 MITSUBISHI DENKI KABUSHIKI KAISHA 发明人 NAKAO SHUJI
分类号 G03F1/08;G03F1/14;G03F1/32;G03F1/36;G03F1/68;G03F1/70;G03F7/20;H01L21/027;(IPC1-7):G03F9/00 主分类号 G03F1/08
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