发明名称 |
POSITIVE-WORKING PHOTORESIST COMPOSITION AND RESIST PATTERNING METHOD USING THE SAME |
摘要 |
PURPOSE: A new improved positive-working photoresist composition having excellent storage stability to provide a patterned resist layer of good pattern resolution is provided. Therefore it is suitable for pattern size diminution by the thermal flow process after development. CONSTITUTION: This crosslinked chemical-amplification positive-working photoresist composition comprises: (A) 100 parts by weight of a hydroxystyrene-based polymer obtained by substitution of a hydrogen atom of at least a part of a phenolic hydroxyl group or a carboxyl group with by acid-dissociable groups; (B) 1 to 20 parts by weight of a radiation-sensitive acid-generating compound; (C) 0.1 to 25 parts by weight of a crosslinkable polyvinyl ether compound; (D) 0.01 to 5 parts by weight of carboxylic acid comprising only a carbon, oxygen and hydrogen atom; and (E) 0.01 to 1 parts by weight of an amine compound.
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申请公布号 |
KR20020018132(A) |
申请公布日期 |
2002.03.07 |
申请号 |
KR20010052726 |
申请日期 |
2001.08.30 |
申请人 |
TOKYO OHKA KOGYO CO., LTD. |
发明人 |
KAWANA DAISUKE;NITTA KAZUYUKI;SATO KAZUFUMI;SHIMATANI SATOSHI |
分类号 |
G03F7/039;C08F2/44;C08F257/00;C08K5/00;C08K5/09;C08K5/17;C08L25/18;G03F7/004;G03F7/40;H01L21/027;(IPC1-7):G03F7/039 |
主分类号 |
G03F7/039 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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