APPARATUS FOR PLANARIZING INSULATION LAYER OF MULTILAYERED SUBSTRATE

摘要

PURPOSE: An apparatus for planarizing an insulation layer of a multilayered substrate is provided to omit an additional process by minimizing the roughness of the substrate, and to improve reliability by minimizing an open or short circuit caused by the roughness. CONSTITUTION: An insulation layer(120) is stacked on the upper and lower portions of a CCL(110) of the multilayered substrate where an inner layer circuit pattern(100) is built as one body. A press unit(150) presses the insulation layer of the multilayered substrate so that the insulation layer is planarized. A planar plate of a stainless material is built as one body by interposing a cushion sheet on a part of a press plate(160).