发明名称 |
CIRCUIT BOARD UNIT AND METHOD OF MANUFACTURE THEREOF |
摘要 |
A circuit board unit (10) includes a circuit board (11) with conductive pads and an electronic device (13) with conductive terminals, which are electrically interconnected through the pads and the corresponding terminals. The electronic device (13) has a sheet (20) for covering itself on the circuit board (11) to seal the gap between the electronic device (13) and the circuit board (11). |
申请公布号 |
WO0219783(A1) |
申请公布日期 |
2002.03.07 |
申请号 |
WO2000JP05843 |
申请日期 |
2000.08.29 |
申请人 |
FUJITSU LIMITED;SASAKI, MAKOTO |
发明人 |
SASAKI, MAKOTO |
分类号 |
H01L21/60;H01L23/04;H01L23/31;H05K3/28 |
主分类号 |
H01L21/60 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|