摘要 |
PURPOSE: A semiconductor device is provided to eliminate the need to consider a delay caused by interconnections of processing elements, by making interconnections among the processing elements through a switch and by making shortest wiring among the processing elements. CONSTITUTION: A package includes a plurality of processors(101,102,103,104) as processing elements. One of the processing elements is selected as a switcher(110) and the switcher is located at the center of the package. Each of the processors includes a corresponding network interface(111,112,113,114) which has communication function. Each network interface is connected to the switcher. Constructed packages are laminated and the switcher of the packages are connected to each other via a router(115) and an extra communication port(120) to produce a system large scale integration(LSI). |